At MWC 2026 in Barcelona, Qualcomm unveiled its flagship processor, the Snapdragon Wear Elite, designed for Wear OS with AI capabilities, alongside the first chip supporting Wi-Fi 8, the FastConnect 8800.
The chip also features an eNPU—a dedicated AI accelerator for functions like keyword recognition, activity tracking, and noise cancellation. This eNPU is one of the energy-efficient modules Qualcomm integrates as a SoC within the main SoC. Additional modules encompass sensors, audio, and display functionalities.
According to Qualcomm, the first commercial devices equipped with the Snapdragon Wear Elite are expected to launch in the coming months.
Previously, Qualcomm introduced the Snapdragon X2 Plus, a 10-core competitor to the Core Ultra 7 265U. Furthermore, Qualcomm is expanding its Snapdragon X computer processors to be compatible with both Windows and Android platforms.
It is noted that the new chip and its associated product line outperform the Snapdragon W5+ Gen 2, which was unveiled last August for smartwatches and AI devices. The Snapdragon Wear Elite boasts a slimmer profile and omits the Oryon cores. It is built on a 3nm process using a big.LITTLE architecture.
The chip includes a large core operating at 2.1 GHz, enhancing app launch speeds, multitasking, and device loading times. Accompanying it are four smaller cores clocked at 1.95 GHz. Compared to the W5+ Gen 2, this processor offers a fivefold increase in each core’s performance.
The Adreno GPU delivers a sevenfold improvement in maximum frame rates at 1080p and 60 FPS resolution. This chip is designed to handle AI tasks directly on the device. It comes equipped with a Hexagon neural processor capable of processing up to 2 billion parameters and 10 tokens per second.
Qualcomm offers six-channel connectivity with Wi-Fi (802.11ax), Bluetooth 6.0, UWB, GNSS, and 5G RedCap and NB-NTN. The robust Wi-Fi, with 80% reduced power consumption, enables the radio module to remain constantly active. Charging to 50% is achieved in just 10 minutes. Compared to the previous chip, battery life has increased by 30%.
The Snapdragon Wear Elite is compatible with Android and Wear OS, as well as Linux for lighter operating systems. This new processor is set to be used in next-generation Samsung Galaxy Watch and Google Pixel Watch smartwatches. It can also be utilized in smart glasses and devices with AI-powered cameras.
The chip also supports Bluetooth 7.0 and Bluetooth HDT (High Data Throughput). HDT is essentially an upgrade to Bluetooth LE, boosting maximum data transfer speeds to 7.5 Mbps. It is scheduled to be available with various Dragonwing Wi-Fi 8 products for the IoT and corporate sectors by late 2026.
Qualcomm has also announced the formation of a strategic alliance with partners to work on the global rollout of 6G starting in 2029. The company’s statement describes 6G as AI-centric, designed for sensing and high-performance computing. However, this provides only a partial insight into the potential applications.
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This enables applications in machine vision, converting text to voice messages, and supporting AI agents in applications such as personal AI assistants, activity tracking, health monitoring, fitness, and device translations.
The new Wi-Fi NIC-compatible chip operates on AI technology. It doubles the peak Wi-Fi speeds compared to Wi-Fi 7-based FastConnect devices. While the new chip is manufactured using the same 6nm process as its predecessor, its enhanced 4×4 radio module configuration provides up to three times greater gigabit range compared to previous standards.
Qualcomm’s promises are primarily focused on AI-based services, yet much of what the company vows to support—such as agent devices for both consumer and enterprise solutions—does not yet fully exist. Nonetheless, Qualcomm promises a global 6G deployment in 2029, with plans to solidify 6G standards and specifications by 2028.
Qualcomm showcased ultra-thin PCs powered by Snapdragon X2 Elite.
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